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datashee t product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 tsz22111 14 001 www.rohm.com small-sized class-d speaker amplifiers filter-less class-d monaural speaker amplifier bd27400gul general description bd27400gul is a low voltage drive class-d monaural speaker amplifier that was developed for cellular telephones, mobile audio products and the others. the lc filter of the speaker output is unnecessary and the external part can compose a speaker amplifier at three. because the efficiency is high and is low consumption power with the class-d operati on, it is the optimal for the application of the battery drive. also current consumption of 0 a when standby and fast transitions from standby to active with little pop noise make it is suitable for appl ications that switch repeatedly between suspended and active. features ? high output power 2.5w typ.(vdd=5v, rl=4 ? , thd+n=10%, btl ? very small package 9-pin wl-csp ? gain selectable by external resistor ? lc filter less ? protection circuitry (short protection, thermal shutdown, under voltage lockout) ? analogue differential input / pwm digital output ? pop noise suppression circuitry applications ? mobile phone, smart phone, digital video camera key specifications ? operating voltage range: 2.5v to 5.5v ? circuit current(no signal): 2.9ma(typ) ? circuit current(stand by): 0.1 a(typ) ? output power(rl=8 ? ): 0.85w(typ) ? output power(rl=4 ? ): 2.5w(typ) ? start-up time: 3.0msec(typ) ? operating temperature range: -40c to +85c package(s) w(typ) x d(typ) x h(max) vcsp50l1 1.50mm x 1.50mm x 0.55mm typical application circuit(s) figure 1. application circuit vcsp50l1 y + - ia - i - + + i i downloaded from: http:///
datasheet datasheet 2/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul pin configuration(s) bottom view - y + + - figure.2 pin configuration pin description(s) no. name i/o function a1 in+ i positive input terminal a2 gnd p gnd terminal (connect to pgnd terminal) a3 out- o negative output terminal b1 vdd p power supply terminal (connect to pvdd terminal) b2 pvdd p power supply terminal (connect to vdd terminal) b3 pgnd p power gnd terminal (connect to gnd terminal) c1 in- i negative input terminal c2 stby i stand by control terminal c3 out+ o positive output terminal connect vdd(b1 ) and pvdd(b2) on pcb board, and use a single power supply. block diagram(s) figure.3 block diagram y + - - + ia - i downloaded from: http:///
datasheet datasheet 3/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul absolute maximum ratings(ta = 25c) parameter symbol rating unit power supply voltage vddmax 7.0 v power dissipation pd 0.69 (note 1) w stby terminal input voltage range vstby -0.3 to vdd+0.3 v in+, in- terminal voltage ra nge vin -0.3 to vdd+0.3 v storage temperature range t stg -55 to +150 c maximum junction temperature t jmax 150 c operating temperature range t opr -40 to +85 c (note 1) derating in done 5.52 mw/c for operating above ta R 25c (mount on 1-layer 50 .0mm x 58.0mm x 1.6mm board) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta= -40c to +85c) parameter symbol min typ max unit power supply voltage vdd 2.5 3.6 5.5 v common mode input voltage range vic +0.5 - vdd-0.8 v electrical characteristics (unless otherwise specified ta=25c.vdd=3.6v.r l =8 ? . btl connection) parameter symbol min typ max unit conditions circuit current (no signal) i cc - 2.9 5.4 ma active mode, no load circuit current (standby) i stby - 0.1 - a standby mode output power 1 p o1 450 680 - mw 8 ? , f=1khz, thd+n=1% *1 output power 2 p o2 550 850 - mw 8 ? , f=1khz, thd+n=10% *1 output power 3 p o3 - 2.5 - w 4 ? , f=1khz, thd+n=10% *1 voltage gain gain 285k ? ri 300k ? ri 315k ? ri v v btl, rl=100k ? total harmonic distortion thd+n - 0.18 - % 8 ? , f=1khz,0.4w output noise voltage vno - 40 - vrms a-weighting power supply ripple rejection ratio psrr - 64 - db 0.1vp-p, f=217hz common mode rejection ratio cmrr - 55 - db 0.1vp-p, f=217hz input impedance zin - 150 - k ? switching frequency f osc 200 250 300 khz start-up time ton 1 3 5 msec stby threshold voltage high level v stbyh 1.4 - vdd v active mode low level v stbyl 0 - 0.4 v stand by mode stby input impedance r stby 210 300 390 k ? *1: band-width = 400 30khz, btl=bridge tied load (voltage between a3-c3.) gain adjustment please use a gain adjustment below 26db (input resistor ri 15k ? ) downloaded from: http:///
datasheet datasheet 4/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves figure.4 figure.5 figure.6 figure.7 downloaded from: http:///
datasheet datasheet 5/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.8 figure.9 figure.11 figure.10 downloaded from: http:///
datasheet datasheet 6/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.12 figure.14 figure.13 figure.15 downloaded from: http:///
datasheet datasheet 7/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.18 figure.19 figure.17 figure.16 downloaded from: http:///
datasheet datasheet 8/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.20 figure.23 figure.22 figure.21 downloaded from: http:///
datasheet datasheet 9/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.24 figure.27 figure.26 figure.25 downloaded from: http:///
datasheet datasheet 10/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.28 figure.31 figure.30 figure.29 downloaded from: http:///
datasheet datasheet 11/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul typical performance curves - continued figure.32 figure.35 figure.34 figure.33 downloaded from: http:///
datasheet datasheet 12/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul application example(s) connect vdd(b1) and pvdd(b2) on pcb board, and use a single power supply. (1)differential input figure.36 differential input for mobile phone figure.37 differential input with coupling input capacitors y + - ia - i iial i y + - - + + y l i i + - y + - ia - i i iial i y + - - + + y l i i i - + downloaded from: http:///
datasheet datasheet 13/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul (2)single-ended input ? it is possible to input audio signal from in+ terminal, or in- terminal when single-end mode. ? don't make the input terminal (no input terminal, c1 terminal in above figure) open. pop noise may be caused when the power supply starts up or the standby is released, if input terminal is opened. ? connect non signal input side(c1 in above figure)to gnd throug h ci, and make the value of ri, ci of non signal input side same as the value of signal input side (a1 in above figure). pop noise may be caused if each values of ci, ri are different, because the values of ci, ri decide the rise of input termina l dc voltage when start-up. difference of input terminal dc voltages may make pop noise. ? make the value of ri, ci of non signal input side same as t he value of signal input side when making lpf(low pass filter) at previous stage of ci. ? put external input resistor ri as close as possible to this ic. selection of components externally connected ? description of external components input coupling capacitor (ci) and input resistor (ri). it makes an input coupling capacito r 0.1uf. input impedance is 150k . it sets cutoff frequency fc by the following formula by input coupling capacitor ci and input impedance ri. in case of ri=150k , ci=0.1uf, it becomes fc = about 10 hz. power decoupling capacitor (cs) it makes a power decoupling capacitor 10 f. when making capacitance of the power decoupling capacitor, there is an influence in the audio characteristic. when making small, careful for the audio char acteristic at the actual application. figure.38 single-ended input [z] i i ? ? ? y + - ia - i i y il - + i + y l i i i downloaded from: http:///
datasheet datasheet 14/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul power dissipation i/o equivalence circuits pin name pin no. in+ in- a1 c1 -+ 150k vdd in+ in- gnd out+ out- c3 a3 vdd out+ out- gnd stby c2 300k vdd stby gnd 690 25 50 75 100 125 150 0 ambient temperature [c] power dissi p ation pd ( mw ) (*1) rohm standard board mounted. board size 50mm58mm,1layer material: fr4 glass-epoxy (copper foil area: not more than 3%) derating in done at 5.52mw/c above ta=+25c. downloaded from: http:///
datasheet datasheet 15/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 50mm58mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
datasheet datasheet 16/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul operational notes C continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 39. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 15. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. downloaded from: http:///
datasheet datasheet 17/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul ordering information b d 2 7 4 0 0 g u l - e 2 part number package gul:vcsp50l1 (wl-csp) packaging and forming specification e2: embossed tape and reel marking diagrams part number marking package orderable part number 2700 vcsp50l1 BD27400GUL-E2 vcsp50l1(top view) 2700 part number marking lot number 1pin mark downloaded from: http:///
datasheet datasheet 18/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul physical dimension tape and reel information package name vcsp50l1(bd27400gul) < tape and reel information > tape embossed carrier tape quantity 3000pcs direction of feed e2 the direction is the pin 1 of prod uct is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand downloaded from: http:///
datasheet datasheet 19/19 tsz02201-0c1c0e754430-1-2 ? 2012 rohm co., ltd. all rights reserved. 23.apr.2014 rev.003 www.rohm.com tsz22111 15 001 bd27400gul revision history date revision changes 05.ap r .2012 001 new release 05.no v .2012 002 all. change to a ne w format 23.apr.2014 003 p.3. change unit of a output power3 mw -> w change the value of psrr 56db->64db p.17 change part number marking p.18 change to a new format at physical dimension tape and reel information downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ge rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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